Superior Heat Dissipation With Repellix

porosityOne of the major design concerns with mobile electronics is thermal management. As devices operate faster and faster, and power brighter and larger screens, they produce more and more heat. Furthermore, sensitivity of the materials to heat fluctuations grows as the chip and layout dimensions shrink. Any protective coatings must not sacrifice heat dissipation if they are to be attractive to modern product designers.

Repellix offers a very favorable option. It is semi-porous by nature, which allows contact between the ambient air and the underlayer. It is also quite thin, on the order of 100 nm, making it an inefficient (poor) thermal insulator.

The drawings on the left portray the dimensional difference between Repellix and a typical spray on conformal coating. The minimum thickness for the acrylic is 2 mils, which is equivalent to 100 thicknesses of Repellix at 500 nm.

This difference in thickness causes an insulative effect which leads to heat build up under the thick spray coat. This heat adversely effects the performance and reliability of most devices. The Repellix coat with its thin, semi-porous, and highly transmissive nature offers only miniscule delta T along the thermal path.

High frequency and rich data devices produce rapid duty cycles that require rapid heat transfer to prevent heat build up. The thicker and more insulative the coating, the more it exacerbates the problem. The coating traps the heat from reaching the very environment it needs to reach for cooling. In contrast, Repellix can accomodate these rapid duty cycles without damaging or effecting the circuit it protects.

Contact Information

Address:
Menlo Park, California 94025

Phone: (650) 324-1824
E-Mail: information@insurftech.com